Product Detail

Professional Manufactur custom design pcb Board pcba 

for electric fireplace

Product description

 



Product Description 

 

Professional Surface Mount Technology Assembly Line

 

" Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to

temporarily attach one or several electrical components to their contact pads, after which the entire assembly 
is subjected to controlled heat, which melts the solder, permanently connecting the joint. Shenzhen Sunsoar Circuit factory,

established in 2008, is a high-end PCB&PCBA manufacturer in PCB and components assembly fields.."

 

 

Best PCB Wave Soldering Service From Sunsoar Circuit

" PCB Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is

passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave.

Shenzhen Sunsoar Circuit Factory has own pcb wave soldering lines and manual DIP soldering lines, it can meet the

different customer’s needs."



Items	PCB Assembly Technical Data
1.	Professional Surface-mounting and Through-hole soldering Technology
2.	Various sizes like BGA,QFN,0402,0201 components SMT technology
3.	ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4.	PCB Assembly With UL,CE,FCC,Rohs Approval
5.	Nitrogen gas reflow soldering technology for SMT
6.	High Standard SMT&Solder Assembly Line
7.	High density interconnected board placement technology capacity
8.	AOI Testing, Fuction testing,working testing

 





 


 

Our Advantages



 

 

Product Capability

SHENZHEN YUZHIXIANG ELECTRONICS CO., LTD
Sunsoar Precision Electronic (HK) Limited
Production Capability
Files	Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material	FR-4, Hi-Tg FR-4,  Lead free Materials (RoHS Compliant) , 22F, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.	1 - 20 Layers
Board thickness	0.0075"(0.2mm)-0.205"(5.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.5OZ - 5OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width (a)	4mil(0.1mm)
Min Space Width (b)	4mil(0.1mm)
Min Annular Ring	0.15mm
Min. BGA Pitch (b)	0.25mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:01
Hole Registration	0.004"(0.1mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-3u'
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004'(±0.1mm)
Beveling	30°      45°
V-cut	15° 30° 45° 60°
Surface finish	HASL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver,  immersion Tin, OSP, Carbon  INK
Certificate	ROHS  ISO9001:2000  SGS  UL
Special requirements	Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger

Our Production Line

 



 



 


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